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MJ series http://cdn-reichelt.de/documents/datenblatt/B400/MJ.pdf, hand-soldering, 5.0x3.2mm^2 package 14-lead dip package, row spacing 15.24 mm (600 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP Switch SPST.

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