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5566-14A, example for new part number: 5273-08A example for new part number: 26-60-4040, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53048-0710, 7 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CB), generated with kicad-footprint-generator ipc_gullwing_generator.py 32-lead plastic TSOP; Type II TSOP-II, 44 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Net tie, 3 pin, 0.5mm square SMD rectangular pad as test Point, diameter 1.0mm wire loop as test Point, diameter 1.5mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex PicoBlade Connector System, 5267-11A, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST VH series connector, B10B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator TE, 826576-6, 6 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2106, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, B9P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 25.24 mm (993 mils SMD DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile JPin SMD 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 3M 14-pin zero insertion force socket, through-hole, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST , Piano, row spacing 10.16 mm (400 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST , Slide, row spacing 22.86 mm.

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