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Vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf WQFN, 42 Pin (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-120-02-xx-DV-TE, 20 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-9)), generated with kicad-footprint-generator JST EH series connector, B12B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM07B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-104-02-xx-DV-TE, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 8.6, Wuerth electronics 97730356332 (https://katalog.we-online.com/em/datasheet/97730356332.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 3.5, Wuerth electronics 9775056960 (https://katalog.we-online.com/em/datasheet/9775056960.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, B9B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST PH series connector, B12B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST XH series connector, B5B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-109-02-xxx-DV-LC, 9 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/AD7682_7689.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.5mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.25 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0301, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System.

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