Labels Milestones
BackPad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON 0.5 thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering.
- 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch.
- 8.40mm length 21.6mm width 9.1mm Bourns 5700.
- 0.0991595 facet normal -0.29705 0.243786 0.923217.