Labels Milestones
BackOmron_A6S-210x, Slide, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 48-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size.
- HTSOP, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL3115A2.pdf#page=42), generated with kicad-footprint-generator.
- TO-220F-4, Horizontal, RM 5.45mm, .