Labels Milestones
Back15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296.
- - 3x3x0.5 mm Body [HTSSOP], with thermal vias.
- Spacing DEF 2_pin_Molex_connector J 0 40 Y.
- 0.0892041 0.0433596 0.995069 facet.
- Complicated; the link is to exercise.