3
1
Back

16.51 mm (650 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-3 Vertical RM 2.54mm TO-220-4 Vertical RM 10.9mm TO-247-2, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 2.54mm TO-247-4, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 2.54mm TO-220-4, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-7, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 1.7mm Pentawatt Multiwatt-5 TO-220-7, Vertical.

New Pull Request