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BackLayer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" "Name": "Top Solder Paste" "Name": "Top Solder Paste" "Name": "Bottom Solder Paste" "Name": "Top Solder Paste" "Name": "Top Solder Paste" "Name": "Top Silk Screen" "Name": "Top Silk Screen" "Name": "Top Solder Mask" "Name": "Bottom Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file Unescape Schematics/SynthMages.pretty/SOCKET_2_PIN_Header.kicad_mod Normal file View File Latest commits for branch pcb_finalization re-re-remove the mysterious extra trace Add notes about wiring SW15 cross-board Add notes about UX component wiring 9f9f6acf76f746b4755da71c07bb656091774052 SMT updates SMT updates Checkpoint after fixes but before shrinking boards 007cc05932dfa23f85127799f5505afc7b25772e Stuff all teh scad files in aac0a4a5b4 Notes from debugging Clock POT is the cheaper option but won't reproduce tiny smooth curves all that well. MSLA (resin) printing will do far better detail work, but with an eye towards doing it all in one module with integral chip antenna (http://ww1.microchip.com/downloads/en/DeviceDoc/60001380C.pdf Cypress EZ-BLE PRoC Module (Bluetooth Smart) 21 Pin Module Digi XBee SMT RF ESP WROOM-02 espressif esp8266ex 2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf NINA-B111 LGA module 42 Pin https://content.u-blox.com/sites/default/files/NINA-B1_DataSheet_UBX-15019243.pdf#page=30 NINA ublox u-blox b111 bluetooth nrf52840 module Omron Relay, DPST, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Relay, SPDT Form C, Gull Wings, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Data+Sheet%7F108-98001%7FZ.1%7Fpdf%7FEnglish%7FENG_DS_108-98001_Z.1.pdf TE IM-Series Relay J JLeg AXICOM HF3-Series Relay Pitch 1.27mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502585-0270 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00482-02.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-133-02-xxx-DV-BE-A, 33 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator Mounting.
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