Labels Milestones
Back15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 20x20 grid, 17x17mm.
- 5.25861 3.8206 20 vertex -6.04355.
- 0.533413 0.83023 vertex 6.85323 6.50317 3.54602.
- Normal -9.960973e-01 -6.322280e-03 -8.803563e-02 vertex.
- Vertex 9.238088e-001 6.974807e+000 9.983999e+000.