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UFBGA 132 Pins, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA.

• Vertex 7.34599 0.0206242 6.86125 facet normal 0.551274.
• 0.956545 facet normal 0.782844 -0.468318.
• Vertex 4.403623e+000 -3.613747e+000 9.983999e+000 vertex 1.726210e+000.
• 0.630119 -0.773011 0.0735069 vertex -6.58293.

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