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10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf DIP Switch SPST Slide 8.61mm 338mil SMD SMD 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 9x-dip-switch SPST CTS_Series194-9MSTN, Piano, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 5.08mm 2.54 4-lead dip package with missing pin 5, row spacing 15.24 mm (600 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package for Kodenshi SG-105 with PCB locator, 6 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 5.1, Wuerth electronics 9776060960 (https://katalog.we-online.com/em/datasheet/9776060960.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, 64800711622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41791-0012 example for new part number: AE-6410-04A example for new part number: 26-60-4120, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST GH series connector.

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