Labels Milestones
BackModule, Patch on Top, https://www.quectel.com/UploadImage/Downlad/Quectel_L80-R_Hardware_Design_V1.2.pdf QFN-24, Pitch 1.20 no EP, https://source.sierrawireless.com/resources/airprime/hardware_specs_user_guides/airprime_xm1100_product_technical_specification QFN-20, Pitch 1.20 no EP, https://source.sierrawireless.com/resources/airprime/hardware_specs_user_guides/airprime_xm1100_product_technical_specification ublox LEA.
- 8 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with.
- Size 71.1x9.8mm^2 drill 1.3mm.