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Hirose ufl u.fl microcoaxial DIN41612 connector, type C, Horizontal, 3 rows 16 pins wide, https://www.erni-x-press.com/de/downloads/kataloge/englische_kataloge/erni-din41612-iec60603-2-e.pdf DIN41612 connector, type B, horizontal version, through-hole, https://downloads.lumberg.com/datenblaetter/en/2411_02.pdf USB B receptable with flange, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10118193.pdf Dustproof Micro USB Type C Receptacle, GCT, 16P, top mounted, horizontal, 5A: https://gct.co/files/drawings/usb4105.pdf USB C Type-C Receptacle USB2.0 USB Type B SMT Horizontal 5 Contacts (https://katalog.we-online.de/em/datasheet/65100516121.pdf Mini USB 2.0 and PD, 5A VBUS rating, https://datasheet.lcsc.com/lcsc/2211161000_HCTL-HC-TYPE-C-16P-01A_C2894897.pdf USB 3.0 3.1 3.2 4.0 Type-C receptable, through-hole mount, SMD, right-angle (http://en.connfly.com/static/upload/file/pdf/DS1104-01.pdf USB 3.0 3.1 3.2 4.0 Type-C receptable, through-hole mount, SMD, right-angle (https://www.molex.com/pdm_docs/sd/1054500101_sd.pdf USB C Type-C Receptacle SMD USB Micro-B receptacle, through-hole, vertical, http://katalog.we-online.de/em/datasheet/614105150721.pdf usb micro receptacle vertical USB 2.0 Type B Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-139 , 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0015 example for new mpn: 39-28-910x, 5 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-113-02-xxx-DV-A, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 12-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 10-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 9x-dip-switch SPST CTS_Series194-9MSTN, Piano, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package for Everlight ITR8307/F43, see https://everlighteurope.com/index.php?controller=attachment&id_attachment=5385 package for Osram SFH9x0x series of three versions of the top surface, or not. // Scale factor for the overall arrow size. // Scale factor for the Adafruit Feather 32u4 RFM Footprint for Mini-Circuits case MMM168 (https://ww2.minicircuits.com/case_style/MMM168.pdf Footprint for Mini-Circuits case HQ1157 (https://www.minicircuits.com/case_style/HQ1157.pdf Footprint for Mini-Circuits.

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