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RND 205-00033, 12 pins, pitch 5mm, size 55x9mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/2138224.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00024 pitch 10mm size 45x10.3mm^2 drill 1.3mm pad 2.6mm terminal block RND 205-00251, 12 pins, single row style2 pin1 right Through hole angled socket strip SMD 1x34 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x11 1.27mm double row surface-mounted straight socket strip, 2x38, 2.54mm pitch, 8.51mm socket length, double rows Through hole pin header THT 1x14 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x28 1.00mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x40 2.00mm single row style1 pin1 left Surface mounted socket strip THT 2x31 2.00mm double row Through hole angled pin header SMD 1x16 1.27mm single row Surface mounted socket strip SMD 2x12 1.00mm double row surface-mounted straight pin header, 2x35, 1.00mm pitch, double rows Through hole angled socket strip SMD 1x25 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x32 2.54mm single row style1 pin1 left Surface mounted socket strip THT 1x26 2.00mm single row Surface mounted pin header THT 1x21 1.00mm single row 0.8 mm Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins, weld tabs, board locks (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 9x9mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 3.639x3.971mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 10x10mm package, pitch 0.65mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AA), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0830, 8 Pins.

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