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28-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils SMD DIP Switch SPST Piano 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 1.27mm Multiwatt-7 staggered type-2 TO-220-4 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220F-7 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 10.9mm TO-264-3, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 1.7mm staggered type-1 TO-220F-9, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Horizontal RM 5.475mm SOT-93 TO-220-2, Horizontal, RM 2.286mm SIPAK Vertical RM 5.08mm TO-220-2, Vertical, RM 1.7mm, IIPAK, I2PAK.

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