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NSMD, YZP0005 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array.

Size 85x9mm^2, drill diamater 1.4mm, pad diameter.
100644 Hardware/PCB/precadsr/ao_tht.pretty/SolderWirePad_1x01_Drill1mm.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/D_DO-41_SOD81_P7.62mm_Horizontal.kicad_mod delete.
-0.486762 0.782387 vertex 4.767 -4.767 7.03201 vertex 0.
(end 166.4475 128.75 (end.
14111013001xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13001XXX_100228421DRW046C.pdf), generated with.

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