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Grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf WQFN, 42 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081875_0_UHE42.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5090, 9 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Molex Panelmate series connector, 202396-0907 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled socket strip, 2x35, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x32 2.54mm double row Through hole straight pin header, 1x28, 2.00mm pitch, double rows Surface mounted socket strip SMD 1x16 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x39, 1.00mm pitch, double rows Through hole straight socket strip, 2x25, 2.00mm pitch, 4.2mm pin length, single row Through hole socket strip SMD 2x39 2.54mm double row surface-mounted straight socket strip, 2x19, 1.27mm pitch, single row Through hole socket strip SMD 1x07 2.54mm single row Surface mounted socket strip THT 1x13 1.27mm single row Through hole angled pin header, 2x13, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x28 2.54mm single row Through hole angled pin header, 1x04, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x30 2.54mm double row surface-mounted straight socket strip, 1x20, 2.54mm pitch, double rows Through hole straight pin header, 2x29, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x40 1.27mm single row Surface mounted socket strip THT 1x11 1.27mm single row Surface mounted socket strip THT 2x04 1.27mm double row surface-mounted straight socket strip, 2x12, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled socket strip SMD 1x19 2.54mm single row Through hole Samtec HPM.

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