Labels Milestones
BackPT-15-V02, http://www.piher-nacesa.com/pdf/14-PT15v03.pdf Potentiometer vertical Bourns 3214X Potentiometer, horizontal, Omeg PC16BU, http://www.omeg.co.uk/pc6bubrc.htm Potentiometer vertical Bourns 3214W Potentiometer, vertical, Bourns 3266W, https://www.bourns.com/docs/Product-Datasheets/3266.pdf Potentiometer horizontal Bourns 3296Z Potentiometer, horizontal, Piher PC-16 Dual, http://www.piher-nacesa.com/pdf/20-PC16v03.pdf Potentiometer vertical Vishay T73YP Abracon RHCP ceramic patch antenna 854-882Mhz, 5dBi Johanson 2450AT43F0100 SMD antenna 2400-2500Mhz, 3.7dBi, https://www.molex.com/content/dam/molex/molex-dot-com/products/automated/en-us/productspecificationpdf/479/47948/PS-47948-001-001.pdf?inline Johanson 0900FM15K0039 DFN, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 12)), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 8, Wuerth electronics 9771110360 (https://katalog.we-online.com/em/datasheet/9771110360.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.1 mm² wire, basic insulation, conductor diameter 0.48mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector Molex Micro-Latch side entry Molex PicoBlade Connector System, 53047-0910, 9 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Lead Frame Chip Scale Package - 3x3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package - 10x10x0.9 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole pin header SMD 1x31 1.00mm.
- Mitchell Hashimoto Permission is hereby granted.
- 33729ec97f6dd2ed68c4ca06088ce0b21651948d Mon Sep 17.