Labels Milestones
BackCoilcraft XFL2010, Shielded power inductor, 3.0x2.8x2.5mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-1004 unshielded SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5340 Microsemi Powermite 2 SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5340 Microsemi Powermite 2 SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5341 Microsemi Powermite 2 SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5339, https://www.onsemi.com/pub/Collateral/457-04.PDF QFN, diode, 3.3x3.3x1mm (https://www.wolfspeed.com/media/downloads/846/C3D1P7060Q.pdf Diode, Universal, SMB(DO-214AA) or SMC (DO-214AB), Handsoldering, Diode Universal SMA (DO-214AC) or SMB (DO-214AA), Handsoldering, Diode Universal SMB(DO-214AA) SMC (DO-214AB) Handsoldering Diode SMB (DO-214AA) Handsoldering Diode SMB (DO-214AA) Handsoldering Diode SMF (DO-219AB), http://www.vishay.com/docs/95572/smf_do-219ab.pdf D_SOD-128 (CFP5 SlimSMAW), https://assets.nexperia.com/documents/outline-drawing/SOD128.pdf 8.1x10.5mm, 4A, single phase bridge rectifier case 16.7x16.7 Vishay GBU rectifier package, 5.08mm pitch, single row style2 pin1 right Through hole straight pin header, 1x10, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled pin header, 1x29, 1.27mm pitch, 3.9x4.9mm body, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x19 1.27mm double row surface-mounted straight pin header, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip THT 2x01 1.00mm double row Through hole angled pin header THT 1x28 2.00mm single row style1 pin1 left Surface mounted pin header SMD 2x03 2.00mm double row Through hole straight socket strip, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x20, 2.54mm pitch, single row Through hole Samtec HPM power header series 3.81mm post length, 1x02, 5.08mm pitch, single row Through hole angled socket strip SMD 2x07 1.00mm double row surface-mounted straight pin header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip THT 1x11 1.00mm single row Through hole angled pin header THT 1x23 2.00mm single row style2 pin1 right Through hole angled socket strip, 2x21, 2.54mm pitch, double rows Through.
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