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Back

Header, 1x02, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header THT 2x23 1.27mm double row surface-mounted straight socket strip, 1x30, 2.54mm pitch, single row Through hole vertical IDC box header THT 1x13 1.00mm single row (from Kicad 4.0.7!), script generated Through hole socket strip THT 1x16 1.27mm single row Through hole straight pin header, 2x32, 2.54mm pitch, single row Through hole angled pin header, 2x20, 2.54mm pitch, double rows Through hole straight socket strip, 1x03, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x02, 1.00mm pitch, double rows Through hole straight pin header, 1x22, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x31 2.00mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x19, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x26 1.27mm double row Through hole angled socket strip THT 2x26 2.54mm double row surface-mounted straight socket strip, 2x12, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x38 1.00mm single row Surface mounted socket strip SMD 1x06 1.27mm single row male, vertical entry, strain relief clip Harwin LTek Connector, 16 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.5mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf WLCSP-49, 7x7 raster, 3.89x3.74mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (https://www.silabs.com/documents/public/data-sheets/si7210-datasheet.pdf), generated with.

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