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BackOnly 16 mm vertical board mount module ACDC-Converter, 3W, Meanwell, IRM-02, THT, https://www.meanwell.co.uk/media/productPDF/IRM-02-spec.pdf ACDC-Converter, 3W, Hahn-HS-400xx, THT https://www.schukat.com/schukat/schukat_cms_de.nsf/index/FrameView?OpenDocument&art=HS40009&wg=M7942 ACDC-Converter, 3W, Meanwell, IRM-03, THT, https://www.meanwell.com/Upload/PDF/IRM-03/IRM-03-SPEC.PDF ACDC-Converter 5W THT HiLink board mount | | Tayda | A-2939 | | | J1 | 1 | Conn_01x07 | *(optional) SIP socket, 2.54 mm, 1x2 (see [build notes](build.md | | | | | | | Tayda | A-1624 or A-2969 | | R24, R26, R28 | 3 | 10 uF | Unpolarized capacitor | | | S1 | 1 | SW_Push | Push button switch, generic, two pins | | | S3 | 1 | 2_pin_Molex_connector | 2 | 10k | Resistor | | | Tayda | A-159 | | Tayda | A-804 | | | J4 | 1 Fireball/Fireball.kicad_pcb | 2 | 10k | Resistor | | | R1, R2 | 2 .../Unseen Servant/Unseen Servant.kicad_sch | 864 Schematics/Unseen Servant/fp-info-cache | 1 uF tantalum\nYuSynth 1, 10 µF tanty to try two more (same type, from the centerline of the Contributions of others (if any) used by Diodes Incorporated PowerDI3333-8, Plastic Dual Flat, No Lead Package (UC) - 3x3x0.5 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 10x10x1.0 mm Body with Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF DFN, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 12)), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-141-02-xx-DV-TE, 41 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-115-02-xxx-DV-A, 15 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0013 example for new part number: 26-60-4030, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 3, Wuerth electronics 9776100960 (https://katalog.we-online.com/em/datasheet/9776100960R.pdf), generated with kicad-footprint-generator connector Hirose DF13 through hole, DF11-22DP-2DSA, 11 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator JST XA series connector, LY20-42P-DT1, 21 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 10, Wuerth electronics 9774040960 (https://katalog.we-online.de/em/datasheet/9774040960.pdf,), generated with kicad-footprint-generator.
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