Labels Milestones
BackSmall outline package; 44 leads; body width 16.90 mm Power-Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 5x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead.
- HE10 (Series 50, (https://www.reboul.fr/storage/00003af6.pdf Through.
- -1.28613 -3.10499 18.4724 vertex -3.07861 1.31556 18.4809 vertex.