Labels Milestones
BackWith Exposed Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Quad Flat, No Lead Package (MA) - 2x2x0.9 mm Body [QFN] with corner pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.ti.com/lit/ds/symlink/sn74auc1g04.pdf#page=24), Solder Mask Defined VSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf (page 57)), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 5, Wuerth electronics 9771150360 (https://katalog.we-online.com/em/datasheet/9771150360.pdf), generated with kicad-footprint-generator JST PH series connector, S34B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator JST PHD series connector, 504050-1091 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator Fuse SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 1mm, size source Multi-Contact.
- Igbt diode module 35-lead.
- BMRA00050530, 5.7x5.4x3.0mm, https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf Inductor, Chilisin, BMRA00050530.