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TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 2.54mm, staggered type-2 TO-220-9 Vertical 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 1.7mm staggered type-1 TO-220-5, Vertical, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 1.27mm staggered type-2 TO-220F-7 Vertical RM 1.27mm Multiwatt-7 staggered type-2 TO-220-4 Vertical RM 2.54mm TO-126-3, Vertical, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220F-15, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-7 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Vertical, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 1.27mm staggered type-2 TO-220-4 Horizontal RM 2.54mm TO-220F-3, Vertical, RM 0.9mm, staggered type-1 TO-220-7 Horizontal RM 5.45mm TO-46-2, Pin2 at center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, narrow, drill 0.75mm, hand-soldering variant with enlarged pads (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Inline Wide transistor TO-92L leads in-line (large body variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 5x-dip-switch SPST , Piano, row spacing 5.08 mm (200 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST KingTek_DSHP02TS, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single.

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