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46.5x15mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00023_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00294 pitch 5.08mm size 40.6x11.2mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 236-208 45Degree pitch 7.5mm size 39.8x14mm^2 drill 1.15mm pad 3mm Terminal Block WAGO 236-324, 45Degree (cable under 45degree), 11 pins, pitch 5mm, size 35x10mm^2, drill diamater 1.2mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT single screw terminal block RND 205-00074 pitch 7.5mm size 44x15mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix MKDS-1,5-11 pitch 5mm size 60x7.6mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type171_RT13704HBWC, 4 pins, pitch 5mm, size 10x8.1mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00001_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-108 45Degree pitch 10mm Varistor, diameter 21.5mm, width 5.6mm, pitch 10mm Varistor, diameter 21.5mm, width 7.9mm, pitch 10mm size 55x9mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix PT-1,5-5-3.5-H pitch 3.5mm size 32.5x8.3mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type067_RT01902HDWC, 2 pins, pitch 3.5mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 7.5 of.

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