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QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD.

• Normal -1.782618e-15 -1.159613e-15 -1.000000e+00 facet normal -9.565245e-01.
• SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row.
• Normal -2.957014e-01 6.813501e-03 9.552561e-01 vertex.
• Normal -8.289299e-01 1.083016e-03 5.593514e-01 vertex.
• -1.093935e+02 9.665134e+01 1.047174e+01 facet normal 0.264278 0.161928.

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