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DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CE.PDF DD Package; 14-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Dual Flat No Lead Package (8MA2) - 2x3x0.6 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf SOIC, 8 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0168.PDF), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-113-02-xxx-DV-A, 13 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 6, Wuerth electronics 9774150960 (https://katalog.we-online.de/em/datasheet/9774150960.pdf,), generated with kicad-footprint-generator.

Diameter=10.5mm, Tantal Electrolytic Capacitor, , http://www.vishay.com/docs/42037/53d.pdf.
4.2mm Capacitor C, Rect series, Radial, pin pitch=15.00mm.
(1632 Metric), square (rectangular) end terminal, IPC_7351 nominal.
1x2 (see [build notes](build.md)) | | Q1.

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