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DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 10-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CM (see ON Semiconductor 506AH.PDF DFN, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2018-6.pdf), generated with kicad-footprint-generator JST PH series connector, B10P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, BM12B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf.

LDR 20mm diameter, pin pitch.
Body (http://www.analog.com/media/en/technical-documentation/data-sheets/ADuM7640_7641_7642_7643.pdf 24-Lead Plastic QFN.
PAS6B3M1CESA3-5 or PAS6B3M1CESA2-5 .

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