3
1
Back

SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/98ASA00525D.pdf), generated with kicad-footprint-generator connector JST XH series connector, DF52-11S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 48 Pin (https://www.onsemi.com/pub/Collateral/485BA.PDF), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 16 leads; body width 6.1 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 leads in-line, wide, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92 leads molded, wide, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92 leads in-line, wide, drill 0.75mm TO-92Flat package, often used for hall sensors, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 40.

New Pull Request