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AR Path="/607ED812/60800A40" Ref="R113" Part="1" AR Path="/60A9C088" Ref="R?" Part="1" AR Path="/607ED812/6091D1B4" Ref="S2" Part="1" AR Path="/607ED812/6091D1B4" Ref="S2" Part="1" AR Path="/60A9C088" Ref="R?" Part="1" AR Path="/60B16110" Ref="J?" Part="1" AR Path="/607ED812/609384DB" Ref="#FLG0102" Part="1" AR Path="/607ED812/609384DB" Ref="#FLG03" Part="1" AR Path="/607ED812/60A9C081" Ref="R26" Part="1" AR Path="/607ED812/60C38343" Ref="R22" Part="1" From 3d279dd88cba890e1ff05b6fd01cb5480b1f325e Mon Sep 17 00:00:00 2001 Subject: [PATCH] Assorted updates More layout updates Delete 'Panels/futura medium condensed bt.ttf 935360b933 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin' e825437e5db64d4ef13181f883b9fe719cf4c2a1 Upload files to '3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels' Clock POT is too small; need more than 100k to get 1:1 between schematic and PCB, no warnings schematic start, and some example modules Latest commits for file Fireball/Fireball_panel.kicad_pro Latest commits for file Schematics/MK_Schematic.png rev "2.0 alpha 5" 1 Tag RSS Feed Update Future Module Ideas Futura Heavy BT.ttf Normal file View File Panels/title_test_36.stl Normal file View File 3D Printing/Cases/Eurorack 2-Row/2row_frame.scad Executable file View File Hardware/Panel/precadsr_panel_al/precadsr_panel_al.pretty/Bigger_Push_Switch_Hole.kicad_mod Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/D_DO-41_SOD81_P7.62mm_Horizontal.kicad_mod Normal file Unescape Schematics/SynthMages.pretty/C_Rect_L22.0mm_W6.1mm_P20mm_MKT_BIG_RED_CAP.kicad_mod Normal file View File 3D Printing/Pot_Knobs/Pot3.STL Executable file View File 3D Printing/Tools/Eurorack_Nut_Driver_8mm.stl Executable file View File 3D Printing/AD&D 1e spell names in Filmoscope Quentin' 34a82a463f Delete '3D Printing/Panels/SPIDER CLIMB.png' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels' Clock POT is too small for a single 0.25 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 14-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf Maxim Integrated TSOC-6 D6+1,https://datasheets.maximintegrated.com/en/ds/DS2401.pdf, https://pdfserv.maximintegrated.com/land_patterns/90-0321.PDF ATPAK SMD package, orientation marker at cathode, https://dammedia.osram.info/media/resource/hires/osram-dam-6035009/SFH%204253_EN.pdf LED, SMD, 0404, 1x1x1.65mm, https://www.we-online.com/catalog/datasheet/150044M155260.pdf Electrosmith Daisy Seed Microcontroller Module ARM Cortex-M7 Audio Codec ESP8266 development board Common footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition.

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