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Strip, HLE-126-02-xxx-DV-A, 26 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S38B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0710, with PCB locator, 3 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 10, Wuerth electronics 97730606332 (https://katalog.we-online.com/em/datasheet/97730606332.pdf), generated with kicad-footprint-generator JST XH series connector, B12B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST ZE series connector, 502386-1570 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator JST XA series connector, 502494-1270 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py DSO DSO-8 SOIC SOIC-8 Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (http://www.nve.com/Downloads/ab3.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 14, Wuerth electronics 9776040960 (https://katalog.we-online.com/em/datasheet/9776040960.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 6-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16.

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