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And it has to go in long leg down (from the front panel Added schmancy pcb for v2 front panel candidates v1 and v2

Added schmancy pcb for v2 front panel Added schmancy pcb for v1 build Latest commits for file Datasheets/2N3903-Motorola.pdf # Autorouter files (exported from Eeschema # Autorouter files (exported from Pcbnew *.ses # Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole) Total.

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