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DIP-4), row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 32-lead dip package, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead.

• Secondary Licenses under the terms of Sections.
• AR Path="/60C3833D" Ref="R?" Part="1.
• Melt an m3 heat-set insert //hole(s.
• 0.343403 0.64232 facet normal -0.630109 0.773019.

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