3
1
Back

26.669999999999998mm 1050mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TO-252/DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/ D2PAK DDPAK TO-263 D2PAK-3 TO-263-3 SOT-404 TO-263 / D2PAK / DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-5-11/ TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-7-1/ NDW0007A SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-7-1/ NDW0007A SMD package, http://www.icbank.com/icbank_data/semi_package/to268aa_dim.pdf D3PAK TO-268 D3PAK-3 TO-268-3 SMD package TO-269AA (e.g. Diode bridge), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/mys40.pdf Diotec MicroDil diode bridge package, diameter 9.0mm, pin pitch 36.32mm diameter 50.8mm Vishay IHB-6 Inductor, Radial series, Radial, pin pitch=23.40mm, , diameter=24.4mm, muRATA, 1400series, http://www.murata-ps.com/data/magnetics/kmp_1400.pdf Inductor Radial series Radial pin pitch 2.54mm size 25.9x6.2mm^2 drill 1.1mm pad 2.1mm Terminal Block WAGO 236-148 45Degree pitch 7.5mm size 179x15mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix MPT-0,5-12-2.54 pitch 2.54mm size 15.7x6.2mm^2 drill 1.1mm pad 2.1mm Terminal Block pitch 10.00mm diameter.

New Pull Request