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Connected via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern PL-035, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl052.pdf Footprint for Mini-Circuits case TT1224 (https://ww2.minicircuits.com/case_style/TT1224.pdf) following land-pattern PL-258, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf Footprint for Mini-Circuits case CK605 (https://ww2.minicircuits.com/case_style/CK605.pdf) following land pattern PL-247, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf Footprint for Mini-Circuits case HF1139 (https://ww2.minicircuits.com/case_style/HF1139.pdf) following land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl225.pdf Footprint for Mini-Circuits case MMM168 (https://ww2.minicircuits.com/case_style/MMM168.pdf Footprint for the.

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