Labels Milestones
BackSpacing 10.16 mm (400 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils.
- Ceramic Resin Sealed SMD http://www.foxonline.com/pdfs/fe.pdf, 7.5x5.0mm^2 package IQD.
- Horizontally Mounted, pitch 2.54mm, package size.
- Spacing 6.73 mm (264.