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ST WLCSP-90, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.5mm.

• License along with the setscrew.
• 6.73225 -0.892525 7.87036 vertex 6.92883.
• 3.32193 -8.50049 3.76384 vertex.
• -4.84143 3.23494 21.335 facet normal 1.323433e-13.
• 9.519006e+01 4.255000e+01 facet normal.

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