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HLE-109-02-xxx-DV-LC, 9 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator JST PH series connector, SM10B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP10: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 16 leads; body width 4.4 mm; Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf MSOP, 12 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/APID/ProductDocuments/DataSheets/MIC2207-2MHz-3A-PWM-Buck-Regulator-DS20006470A.pdf#page=22), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-60DS-0.5V, 60 Pins (https://www.molex.com/pdm_docs/sd/537480308_sd.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B30B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (http://www.ti.com/lit/ds/symlink/msp430f5217.pdf#page=120), generated with kicad-footprint-generator ipc_noLead_generator.py WSON6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (https://datasheet.lcsc.com/szlcsc/Realtek-Semicon-RTL8211EG-VB-CG_C69264.pdf#page=77), generated with kicad-footprint-generator JST XA series connector, 501331-0907 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-P (2012-15 Metric), IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf.

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