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Micro-Fit 3.0 Connector System, 53047-0510, 5 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Mounting Hardware, external M3, height 10, Wuerth electronics 9774080243 (https://katalog.we-online.de/em/datasheet/9774080243.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 32 Pin (https://www.analog.com/media/en/package-pcb-resources/package/3416438741201015623cp_32_4.pdf), generated with kicad-footprint-generator JST GH series connector, S36B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [QFN] with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline No-Lead 8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat Pack, 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 12-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 10-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00485-02.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105309-xx07, 7 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-N (7343-30 Metric), IPC_7351 nominal, (Body size from: http://datasheets.avx.com/schottky.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On Type FFC/FPC Connector, For LVDS, 2.33mm Height, Right Angle, Bayonet, 50Ohm, 4GHz, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1478035%7FB1%7Fpdf%7FEnglish%7FENG_CD_1478035_B1.pdf%7F1-1478035-0 BNC RF interface bayonet 50ohm BNC female PCB mount 4 pin, 0.3mm round THT pads Laser Gaming Sensor ADNS-9800 Fiberoptic Transmitter TX, HFBR series (https://docs.broadcom.com/docs/AV02-3283EN TSL2550 ambient light sensor, i2c interface, 6-pin chipled package, http://optoelectronics.liteon.com/upload/download/DS86-2013-0004/LTR-303ALS-01_DS_V1.pdf Optoisolator with LED backlight 160x104 RS-232 I2C or SPI http://www.lcd-module.com/fileadmin/eng/pdf/grafik/edip160-7e.pdf LCD-graphical display with LED backlight 160x104 RS-232 I2C or SPI http://www.lcd-module.com/fileadmin/eng/pdf/grafik/edip320-8e.pdf LCD display 320x340 RS-232 I2C or SPI http://www.lcd-module.com/fileadmin/eng/pdf/doma/dogs104e.pdf LCD 4x10 character 3.3V VDD I2C or.

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