Labels Milestones
Back16.0x17.2mm Pitch 1mm (http://www.st.com/resource/en/datasheet/vnh2sp30-e.pdf MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm (http://www.st.com/resource/en/datasheet/vnh2sp30-e.pdf MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic Stretched Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic Small Outline (SS)-5.30 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 0604 3 pins diameter 5.0mm z-position of LED center 2.0mm, 2 pins LED_Rectangular, Rectangular, Rectangular size 4.0x2.8mm^2 diameter 2.0mm THT pad as test Point, square 4.0mm side length test point wire loop as test Point, diameter 3.0mm z-position of LED center 1.6mm, 2 pins Rectangular size 3.0x2.0mm^2, 2 pins, diameter 5.0mm 3 pins THT ceramic resonator filter filter hand-soldering SMD Resomator/Filter Murata SFECV, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 6.9x2.9mm^2 package SMD Crystal MicroCrystal CC5V-T1A series http://cdn-reichelt.de/documents/datenblatt/B400/CC5V-T1A.pdf, 4.1x1.5mm^2 package SMD Crystal MicroCrystal CC8V-T1A/CM8V-T1A series http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC8V-T1A.pdf, hand-soldering, 2.0x1.2mm^2 package SMD SMT SPST EVQPUM EVQPUD SMD 1x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 9x-dip-switch SPST , Piano, row spacing 5.25 mm (206 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 2x-dip-switch SPST CTS_Series194-2MSTN, Piano, row spacing 5.25 mm (206 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 10x-dip-switch SPST Omron_A6H-10101, Slide, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon PLCC, 20 pins, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 10 pins, pitch 7.5mm, size 22.5x10.3mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00245, 6 pins, http://www.ti.com/lit/ds/symlink/tps737.pdf module CMS SOT223 8 pins, pitch 10mm, size.