Labels Milestones
Back300mil 8-lead dip package, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 14-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD DIP.
- Normal -0.737294 -0.221424 -0.638255 facet normal -0.956672 0.290933.
- 3W, length*width*height=22.2*8*8mm^3, shunt pin pitch.
- 53261-1271 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Molex.
- Package 8-Lead Plastic Small Outline Package.