Labels Milestones
Back32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header SMD 1x22 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x29 1.27mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x15, 2.00mm pitch, double rows Surface mounted socket strip THT 1x07 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x11, 2.54mm pitch, double rows Through hole angled socket strip, 2x33, 1.27mm pitch, single row Through hole angled socket strip THT 2x14 2.54mm double row Through hole angled pin header THT 2x21 1.27mm double row Through hole IDC header, 2x12, 2.54mm pitch, 6mm pin length, single row Through hole straight Samtec HPM power header series 11.94mm.
- Normal 1.000000e+00 0.000000e+00 facet.
- Connector, SM03B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Mounting Hardware.
- Hole 6mm, no annular mounting hole 3.2mm.