Labels Milestones
BackBump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch.
- 205-00016, 6 pins, pitch 3.81mm, size 18.9x7.3mm^2, drill.
- Mount, https://www.neutrik.com/en/product/nc3mafh-ph A Series, 3.
- Unaccent note *R or *L.
- Https://productfinder.pulseelectronics.com/api/open/product-attachments/datasheet/pa4349.104anlt Shielded Molded High Current Inductor, body.