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....5mm_P5.00mm_FKS2_FKP2_MKS2_MKP2.kicad_mod | 35 .../ao_tht.pretty/Perf_Board_Hole.kicad_mod | 16 .../PinHeader_1x02_P2.54mm_Vertical.kicad_mod | 35 ....2mm_P5.00mm_FKS2_FKP2_MKS2_MKP2.kicad_mod | 35 .../Kosmo_Panel_Mounting_Hole.kicad_mod | 17 .../Kosmo_Switch_Hole.kicad_mod | 17 .../Bigger_Push_Switch_Hole_NPTH.kicad_mod | 13 Binary files /dev/null and b/Panels/Font files/futura medium bt.ttf and /dev/null differ # 2-layer, 1oz copper condition "A.Type == 'via'" (condition "A.Type == 'pad' && B.Type == A.Type && A.Net == B.Net" (condition "A.Type == 'track' && B.Type == 'track'" (condition "A.Type == 'pad' && A.Fabrication_Property == 'Castellated pad'" condition "A.Net != B.Net" condition "A.Type == 'track'")) # This would override board outline and milled areas # (condition "A.Type == 'pad' && !A.isPlated()" condition "A.isPlated() && B.Type == A.Type && A.Net == B.Net" (condition "A.Pad_Type == 'NPTH, mechanical' && B.Type == A.Type && A.Net == B.Net" (condition "A.Pad_Type == 'NPTH, mechanical' && B.Type == 'graphic')" # This would override board outline and milled areas # (condition "A.Type == 'pad' && B.Type == A.Type")) # 4-layer condition "A.Type == 'pad' && B.Type == A.Type && A.Net != B.Net" (condition "A.Type == 'via'" condition "A.Type == 'pad' && (B.Type == 'text' || B.Type == 'graphic')" # This would override board outline and milled areas # (condition "A.Type == 'via'" condition "A.Type == 'pad' && B.Type == A.Type")) # 4-layer condition "A.Type == 'pad' && A.Fabrication_Property == 'Castellated pad'" condition "A.Net != B.Net" (condition "A.Pad_Type == 'NPTH, mechanical' && B.Type == A.Type" (condition "A.Type == 'via'" condition "A.Type == 'pad' && A.Fabrication_Property == 'Castellated pad'" (condition "A.Net != B.Net" (condition "A.Type == 'via' && B.Type == 'track'" (condition "A.Type == 'track'" From f12031bb4117bdc0bfa93734f5e1f978a14297b0 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Delete 'Panels/Futura XBlk BT.ttf' Panels/Futura XBlk BT.ttf differ From 52b504dd7cabbf7261c98563d42b1772d3bf6825 Mon Sep 17 00:00:00 2001 Subject: [PATCH 03/13] More assembly notes for v1 build - C1 is too small for a single 2.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-3410, 34 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 3.6, Wuerth electronics 9775066360 (https://katalog.we-online.com/em/datasheet/9775066360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf TDFN, 8 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant BA), generated with kicad-footprint-generator JST ZE series connector, S02B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator connector wire 2.5sqmm double-strain-relief Soldered wire connection with feed through strain relief, for 2.

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