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3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD, YZP0005 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SM) - 5.28 mm Body (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm pad, based on the GitHub page (they'll have "@ something" after them) and download them as separate sheet ## Photos ### Photos ## Documentation: ### Documentation: * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf) * [BOM](Docs/precadsr_bom.md) * [Build notes](Docs/build.md ``` git clone git@github.com:holmesrichards/precadsr.git git clone https://github.com/georgedorn/ttrss-plugin- _comics plugins/ _comics ``` Binary files /dev/null and b/Datasheets/tl074-pinout.jpeg differ Binary files /dev/null and b/3D Printing/Rails/18hp_innie.stl differ Binary files /dev/null and b/Images/befaco_vcadsr.png differ master PSU/Synth Mages Power Word Stun.kicad_pro | 85 cd18ed43dc Added hard sync to schematic, laid out PCB with on-board Fireball/Fireball.kicad_pcb | 8194 Fireball/Fireball_panel.kicad_pro | 504 Fireball/fp-info-cache | 9 create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Panel_Mounting_Hole_NPTH.kicad_mod delete mode 100644 Hardware/PCB/precadsr/precadsr.xml create mode 100644 Fireball/Fireball_panel.kicad_pcb 2666d5803f Footprint selection, some PCB layout choices .../Unseen Servant/Unseen Servant.kicad_pcb | 4 .../PCB/precadsr_aux_Gerbers/precadsr-PTH.drl | 99 .../precadsr_aux_Gerbers/precadsr-job.gbrjob | 2 | 1M | Resistor | | R24, R26, R28 | 4 Schematics/Unseen Servant/Unseen Servant.kicad_sch | 4890 width = 36; // [1:1:84] /* [Holes] */ hole_dist_top = 2.5; rail_clearance = 8.5; // mm from very top/bottom edge and where it is the two clockwise-most pins, looking from below. Clock rate (B100k) (not sure yet which 2 pins LED, diameter 5.0mm z-position of LED center 3.0mm 2 pins diameter 5.0mm z-position of LED center 3.0mm, 2 pins, pitch 5mm, size 40x9.8mm^2, drill diamater 1.15mm, pad diameter 3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf.

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