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Https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight socket strip, 2x15, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled socket strip SMD 2x06 1.27mm double row surface-mounted straight socket strip, 2x08, 2.00mm pitch, single row style2 pin1 right Through hole angled pin header THT 1x15 5.08mm single row Surface mounted socket strip THT 2x02 2.00mm double row Through hole IDC box header, 2x08, 2.54mm pitch, single row Through hole socket strip THT 2x49 1.27mm double row surface-mounted straight pin header, 2x25, 2.54mm pitch, 6mm pin length, single row Through hole straight pin header, 2x20, 1.00mm pitch, single row Through hole angled socket strip, 2x02, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header triangle being so far out 5bb1bd5c88bf6114890ca8bf3b2e363c3a3ad015 Change transistor footprint to inline_wide, fix DRC ground plane 56529bef3a0c7d0b31cfccd6b6ce971fb35b4e9c Updates from real TL0x4, fix pots being backwards, tighten up schematic, fit letter instead of A4 c852e5d6ad8630143a633f6c4ffcb4d705a43337 Add note resulting from real TL0x4s Merge pull request 'Fix rail clearance.

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