Labels Milestones
BackType 34.81 (opto relays/coupler), vertical/standing form, see https://gfinder.findernet.com/public/attachments/34/EN/S34USAEN.pdf Hamamatsu spectrometer, see http://www.hamamatsu.com/resources/pdf/ssd/c12880ma_kacc1226e.pdf 3.2mmx2.7mm, light sensor, i2c interface, 6-pin chipled package, http://optoelectronics.liteon.com/upload/download/DS86-2013-0004/LTR-303ALS-01_DS_V1.pdf Optoisolator with LED and photoresistor 3 Lead Plastic Package OnSemi CASE 100CY, light-direction upwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf Laser Diode, TO-38-ICut, 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO-3.3mm, 3pin Laser Diode, TO5-like (D=9mm), 3pin Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO-3.3mm, 3pin Laser Diode, TO5-like (D=9mm), 3pin Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO5-like (D=9mm), 3pin Laser Diode, TO-3.3mm, 3pin Laser Diode, TO5-like (D=9mm), 3pin Laser Diode, TO-56, 3pin lightpipe triple tower right angle through hole 2.7mm, height 8, Wuerth electronics 9774030243 (https://katalog.we-online.de/em/datasheet/9774030243.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1102, With thermal vias in pads, 3 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator JST PH series connector, BM13B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator connector wire 2sqmm double-strain-relief Soldered wire connection with feed through strain relief, for 6 times 0.5 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 30 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 14-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 676 1 FF676.
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