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(http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin package with missing pin 5, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-Lead Plastic Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf WSON, 6 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator connector Molex Pico-Lock series connector, B4B-PH-K.

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