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Number: 5569-12A2, example for new part number: 26-60-5060, 6 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1010, with PCB cutout, light-direction upwards, see https://www.everlight.com/file/ProductFile/ITR1201SR10AR-TR.pdf reflective opto couple photo coupler package for Kodenshi SG-105F, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105F.pdf package for Everlight ITR8307/F43, see https://everlighteurope.com/index.php?controller=attachment&id_attachment=5385 package for diode bridges, row spacing 22.86 mm (900 mils THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.65mm; see section 6.2 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package.

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