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BackIrd*cos(lf0), ird*sin(lf0), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf0), ord*sin(lf0), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) Total plated holes Total unplated holes count 16 Not plated through holes: unplated through holes: unplated through holes: ============================================================= d9153c70802a10d2fe554f80f1a497b409aac630 f51b7b97734e404127fa5d5d263acbfd66f116e4 Bring in diylc and openscad design ## Mechanical assembly Documentation # ---> KiCad # For PCBs designed using KiCad: https://www.kicad.org/ # Format documentation: http://kicad-pcb.org/help/file-formats/ # Temporary files fp-info-cache # Netlist files (exported from Pcbnew *.ses # Exported BOM.
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